Instruments and Systems: Monitoring, Control, and Diagnostics Annotation << Back Questions of microelectronic pressure sensors manufacturing operating in particularly harsh conditions I.N. BARINOV, V.S. VOLKOV, D.A. KUDRYAVCEVA, B.V. TSYPIN The pressure sensors for harsh environment based on Silicone-on-insulator structure, silicone carbide and polycrystalline diamond are analyzed. Designs of the sensors, the advantages and disadvantages of materials and features of sensitive elements topology are described. Possibility of change in conductivity silicon carbide gages and polycrystalline diamond gages by doping impurities are described. to decrease the temperature dependence and output signal drift by using thin-film getters is proposed. The method to improve the performance of microelectronic pressure sensors by anodic bonding upgrading that avoids vacuum-tight barrier in the manufacturing of the reference cavity of absolute pressure sensors. Using leadless packaging technology for high-temperature contacts are suggested. Keywords: harsh environment, silicone-on-insulator structure, silicone carbide, polycrystalline diamond, anodic bonding, leadless packaging, getter Contacts: E-mail: mzungu@inbox.ru Pp. 39-50.