Instruments and Systems: Monitoring, Control, and Diagnostics Annotation << Back Copper Balance on PCB Layers A.A. KRASILNIKOV, S.A. SOROKIN Copper balance (or copper alignment) – is a set of design techniques that allow you to fill the areas of the board that are not occupied by the pads of the components, or the wires connecting them, with copper foil. Usually, to ensure the balance of copper in areas of the board that are copper-free, a metallization area connected to power net is created. If this is not possible, the voids are filled with small copper “spots” not connected to any net. The topic of copper balance on the layers of a printed circuit board arises primarily when discussing ways to reduce the risks of board deformation (warping and twisting), less often in connection with ensuring a normal thermal regime or minimizing the level of crosstalk. The paper discusses various aspects of the problem, and also provides an algorithm for solving the problem. Keywords: printed circuit board, copper area, warping. DOI: 10.25791/pribor.5.2022.1337 Pp. 19-23.