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Instruments and Systems: Monitoring, Control, and Diagnostics

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Dissipation of Vibration Energy in a Piezoceramic-Substrate Connection
B.S. LUNIN, M.A. BASARAB

The article examines dissipative processes occurring in a layer of adhesive or solder connecting piezoelectric sensors and actuators to
the surface of mechanical resonators. Part of the vibrating energy of the resonator is lost due to bulk and thermoelastic internal friction in
the connecting layer, which worsens the characteristics of devices based on such resonators. The infl uence of the thickness of the connecting
layer and the properties of its material on the dissipation of vibration energy is analyzed. A comparative estimation of the internal friction
introduced into the mechanical resonator when piezoelements are attached to it using adhesive and solder has been made; it has been shown
that the energy dissipated in the solder layer exceeds the energy dissipated in the hardened epoxy adhesive layer by ~10 times.
Keywords: piezoelectric element, internal friction, thermomechanical analysis.

Pp. 01-07.

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